Electronics Forum: dendrites (Page 7 of 11)

BGA washing & Surfactant Packs?

Electronics Forum | Wed Mar 20 20:02:06 EST 2002 | davef

Surfactant. A synthetic detergent made from petrochemicals that lowers the surface tension of water and allows better cleaning in small spaces. Do you have a cleaning issue that requires you to use a surfactant? If so, be aware that you must clean

Water Quality Requirements to wash boards

Electronics Forum | Mon Apr 15 05:04:02 EDT 2002 | ianchan

On a more layman's terms (am not a expert), here goes : 1) resistivity of DI rinse must be greater than 10M-ohms (some say greater than 16M-ohm?), dunno what is the FIX industrial standard? 2) DI water rinse usually is the end zone rinse, before th

BAKING MICRO BGA BOARDS AFTER REFLOW AND WASH

Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken

If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias

Small blister, solder mask

Electronics Forum | Wed Jun 23 13:34:29 EDT 2004 | df_indy

I am four weeks into my new job, there always seems to be some issues here with PCB every week. Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look

Electromigration Testing

Electronics Forum | Sun Jun 27 10:48:46 EDT 2004 | crios

I am a Quality Engineer which went from an Automotive QS9000 company manufacturing ceramic hybrid boards and now I am with a ISO PC mfg. company dealing with PCBA boards. I've been assigned a task in determining the contributing factor to high contam

RoHS parts - leaded solder

Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel

Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint

Chosing ENIG vs OSP

Electronics Forum | Tue Jun 02 17:45:46 EDT 2009 | boardhouse

Hi Nicoleta, As a board shop, either are good choices but in my experience with my customers ENIG has alway been the favorite due to it is easier to work with in regards to not having to tweak your equipment. As long as the board shop that you are u

Relay failures

Electronics Forum | Thu Jul 31 14:58:06 EDT 2014 | rgduval

If it has been determined that it is definitely the relays (and not some other circuit device), you'll want to get the vendor/manufacturer involved for some failure analysis. They'll cut open the components, and try to figure out what's going on in

Electronic Assembly - PCB cleansing and COVID-19

Electronics Forum | Fri Apr 03 08:34:54 EDT 2020 | SMTA-Gregory

We need to be careful with product to avoid introducing a new failure mode, namely corrosion and dendrite growth, especially those running no clean processes! In addition to heat (reflow, wave and some selective soldering processes) killing the vi

Re: Need help with no-clean specs

Electronics Forum | Wed Sep 30 18:43:46 EDT 1998 | Graham Naisbitt

Chrys, Please, refer firsatly to J-STD-001 Appendix D. Now, consider: SIR testing will help define the reliability of your finished assembly - it will not tell you how clean it is. Which do you or your customer prefer? Present SIR testing de


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