Electronics Forum | Fri Sep 10 15:15:24 EDT 1999 | Jennifer
Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and high-ra
Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F
Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si
Electronics Forum | Mon Sep 13 10:55:44 EDT 1999 | K3 Equipment
| Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h
Electronics Forum | Tue Sep 26 11:03:00 EDT 2000 | Wolfgang Busko
Greg: You might look for : - smallest board size - largest board size - finest pitch you are able to handle (safe) - Parts/hour - units/hour (If you find your bottleneck it will be easy to determine) - number and kind of feeders, components per line
Electronics Forum | Thu Dec 18 21:36:03 EST 2003 | pdeuel
Blade angle, print speed, squeegee pressure, should be used in conjenction with one another. The more parellel the blade is to the stencel the more it will tend to float over the solder and the more paste is forced thru the appature. Contrary the gre
Electronics Forum | Thu Nov 09 22:21:18 EST 2006 | John S.
I would think it would be more productive to compare DPMO. Particularly across different products. A simple board of 20 components should yield much higher than a complex board of 200 components. Also, some consideration should be given to the dif
Electronics Forum | Tue May 20 12:20:18 EDT 2008 | danimalz
Does anyone have an easy way to estimate how much solder paste is applied to a smt pcb? I understand it varies on squeegee pressure, stencil thickness, and pitch of the components but I was looking for an average. I would assume that somewhere out th
Electronics Forum | Thu Sep 07 11:24:21 EDT 2017 | slthomas
HI Tsvetan, Can you tell me what material your stencil was fabbed from? I have seen (from different suppliers) references to at least 3 different grain sizes of stainless for laser cut, plus electroformed nickel for laser cut, electroformed nickel,
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
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