Electronics Forum | Tue Jan 08 17:33:26 EST 2002 | davef
You didn�t identify the type of tape you use, but Kapton or similar tape is not an effective method for attaching thermocouples. Search the fine SMTnet Archives for alternatives and comparison of methods. Two methods for mechanically attaching ther
Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park
Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?
Electronics Forum | Thu Jul 22 22:57:14 EDT 1999 | Earl Moon
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Mon May 24 17:17:21 EDT 1999 | JohnW
| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the boar
Electronics Forum | Mon Jan 16 16:19:22 EST 2006 | davef
Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability� Banks, Donald R., et al.; Proceedings of the Technical Program - Surface Mount International; September 10-12,
Electronics Forum | Mon Jul 26 15:25:27 EDT 1999 | APE South, Jack Reed, Asian Sales Administrator
Dear Mr. Park, Ahn yahn haseo and good day to you. If you are currently in Korea, APE has a direct representative there, Omni-Create in Seoul who can give you full information on BGA reball kits available. Essentially, reball kits are custom made t
Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup
| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
