Full Site - : die attach wire bond (Page 7 of 56)

Epoxy and Adhesive

Epoxy and Adhesive

New Equipment | Dispensing

For Die attach / Die bonding / Potting / Casting / Encapsulating / etc.

K-Net International Ltd.,Part

ASM AB530, DS500, AD896

Used SMT Equipment | SMT Equipment

ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com

Customer Satisfaction Technology Company

AI Technology, Inc. (AIT)

Industry Directory | Manufacturer

Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.

Vimic Electronic Corporation

Industry Directory | Manufacturer

Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.

Majelac Technologies

Industry Directory | Manufacturer

Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,

CL15-C Ceramic Die Collet

CL15-C Ceramic Die Collet

New Equipment | Pick & Place

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the ti

Vimic Electronic Corporation

CL17-TU Tungsten Carbide Die Collet

CL17-TU Tungsten Carbide Die Collet

New Equipment | Pick & Place

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the ti

Vimic Electronic Corporation

VASM-C-Ceramic Pick-up Tool

VASM-C-Ceramic Pick-up Tool

New Equipment | Pick & Place

Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. The decision whether to use a Die Co

Vimic Electronic Corporation

Microtek, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..

VASM-Die Pick-up Tool

VASM-Die Pick-up Tool

New Equipment | Pick & Place

The decision whether to use a Die Collet or a Pick-up Tool is crucial to the success of the die bonding process and we provide custom tools designed for coping with special die geometries and other process limitations. We can design and manufacture

Vimic Electronic Corporation


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