Industry News: dipping and profile (Page 7 of 35)

SolderLab Tests Solder for Impurities Based on J-STD-006C and J-STD-001F – Find Out How at APEX

Industry News | 2016-02-18 20:27:15.0

SolderLab today announced plans to exhibit in Booth #2913 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The company tests solder for alloy impurities based on industry standard IPC guidelines for J-STD-006C and J-STD-001F.

SolderLab.com

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste

Industry News | 2015-10-13 19:27:42.0

SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (

Shenmao Technology Inc.

Seika Machinery Introduces the MALCOM DS-10 Dip Tester

Industry News | 2016-01-25 10:44:17.0

Seika Machinery is pleased to introduce the MALCOM DS-10 Dip Tester. The tester provides data transmission to a PC by USB cable, creating a profile function. The dedicated software implements a high level of process management.

Seika Machinery, Inc.

Seika Machinery Introduces Updates to Popular Malcom and Unitech Process Control Systems

Industry News | 2018-08-09 12:24:23.0

Seika Machinery is pleased to announce that it carries six new process control devices from MALCOM and UNITECH. These include: SPS series paste mixers, viscometers, wetting balance testers, profilers / camera systems, reflow simulators and PCB board cleaners.

Seika Machinery, Inc.

KIC and Indium Corporation to Hold Voiding Clinic at APEX

Industry News | 2019-01-08 20:21:17.0

KIC and Indium Corporation will hold a voiding clinic in Booth #1215 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31 at the San Diego Convention Center.

KIC Thermal

KIC's MB Allen to Present at the Long Island SMTA Expo and Technical Forum 2011

Industry News | 2011-09-01 21:20:56.0

KIC announces that its Product Manager MB (Marybeth) Allen will present on the topic of Non-Destructive Profiling Methods at the upcoming SMTA Long Island Expo and Technical Forum on September 21.

KIC Thermal

KIC and Air-Vac to Hold Free BGA Manufacturing and Repair Seminar

Industry News | 2009-10-13 12:56:51.0

San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, in conjunction with Air-Vac Engineering Company will hold a free BGA Manufacturing and Repair Seminar at 6 p.m. on Friday, October 23, 2009 at the Hotel Radisson Case Grande, Ciudad Juarez in Juarez, Mexico.

KIC Thermal

KIC’s e-Clipse and SunKIC Profiler Win the 2009 Global Technology Award

Industry News | 2009-11-19 14:31:38.0

San Diego — November 2009 — KIC announces that two of its products, designed to increase solar cell efficiency through accurate profiling and process optimization, tied for a Global Technology Award. KIC’s e-Clipse solar cell thermocouple (TC) attachment fixture and compact SunKIC profiler tied in the category of Solar Manufacturing Products. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

KIC Thermal

Hentec/RPS Setting Component Lead Tinning Standards and Compliance

Industry News | 2021-03-30 16:42:31.0

Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)


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