Electronics Forum | Mon Oct 19 07:39:15 EDT 2009 | m_imtiaz
Hi, We are facing solder ball problem in manual soldering process (between wire and terminal). we are using no-clean solder (63:37)and temperature setting in iron is around 400 Cel. Can any one suggest me how to solve this problem Any thoughts would
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Fri Jul 15 14:16:09 EDT 2005 | seaK
We have this problem for a long time. It happens to 3 new Mydata MY-9 machine. When pick and place resistor array 0408 (different value, top and bottom side), the solder paste in the middle two terminals missing occasionally. Thought it's because noz
Electronics Forum | Mon Jul 18 18:02:31 EDT 2005 | seaK
Thanks for the response..... The solder is actually printed okay prior to SMT.... And after placing, found missing solders at middle terminals of 0408 resistor arrays.... Package library is checked, component spec looks fine... I am suspecting the
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan
Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so
Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika
Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-
Electronics Forum | Fri Jul 22 03:07:45 EDT 2005 | Joseph
Dear all, As we know there is a high risk of reliability issue due to lead contamination during mixture of NLF component at LF wave soldering process. But we have the following feed back from one of our customer as follow: Concerning the risk of m
