Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef
You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Wed Jul 05 10:54:26 EDT 2006 | slaine
In the last couple of weeks ive been working with a new mechanical design engineer, i knew things were going to be difficult when i caught him putting a trial through a reflow oven using loctight thread lock to hold a smd led in place. but today i ha
Electronics Forum | Wed Sep 01 13:58:10 EDT 1999 | Dave F
| Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective w
Electronics Forum | Tue May 26 22:13:15 EDT 1998 | Pat Copeland
R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommende
Electronics Forum | Wed Jul 05 11:21:33 EDT 2006 | samir
At my 2nd company, I had a design EE come down, look at his product running down the line, looks at the reflow oven... He scoffs sarcastically...and then says, "What the hells so hard about this...you're just running it through an oven." Process an
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Wed Aug 19 12:20:24 EDT 1998 | MARK J.
| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde
Electronics Forum | Mon Sep 25 08:24:25 EDT 2017 | directx995
At the moment we do it like this: We get .csv or .txt pick and place file and .csv or excel bom file. Then I verify every single placement manualy with BOM and delete placements that are not listed on BOM. (Yes, you are right, I do it for 30 placeme
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