Electronics Forum | Mon Aug 13 16:07:08 EDT 2007 | dyoungquist
We run double sided surface mount boards through our Heller oven without any parts falling off the bottom side unless they are too big/heavy. The trick we use is to set the bottom side temperature in the final 3 heat zones 10C-20C lower than the top
Electronics Forum | Wed Jan 05 11:01:37 EST 2000 | Ron Lahat
I have in design a 400mm x 400mm pcb 3.0 mm thick heavily populated with BGAs 50 mil pitch and want to run a double sided reflow process with overlapping BGAs (CS/PS) 1. can I avoid a selective jig for PS BGAs?(weight calculation ?) 2. Is it possibl
Electronics Forum | Thu Jul 15 15:41:00 EDT 1999 | Doug
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
Electronics Forum | Fri Feb 23 15:31:31 EST 2007 | realchunks
Running the BGA first is OK. We run double sided BGA baords all the time without problem.
Electronics Forum | Fri Mar 02 17:56:17 EST 2007 | davef
Samir's correct. We've talked about this previously. Search the fine SMTnet Archives for those discussions, like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=23236
Electronics Forum | Thu Jul 15 14:55:24 EDT 1999 | JohnW
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Thu Mar 01 00:27:58 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Thu Mar 01 00:29:08 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
