Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Quick Overview Solder dross separator SDS-10MS has Patent mixing and separation system which make separation more efficient and easier for operation, it is a best solution for small batch solder dross separation. To get more information from below
New Equipment | Wave Soldering
TW3 is the best benchtop wave solder machine with the most cost-efficiency, but it is functional over your expection, fully like the full-size wave solder machine, Please see details below: 1). It can run either leaded or lead-free process, its enti
New Equipment | Board Handling - Conveyors
American SMT Assembly line Wave soldering machine in feed conveyor Factory Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg Product description: American SMT Assembly line Wave soldering machine
New Equipment | Board Handling - Conveyors
http://www.flason-smt.com/product/SMT-Assembly-line-Wave-soldering-machine-in-feed-conveyor.html SMT Assembly line Wave soldering machine in feed conveyor Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:App
Wave soldering machine in feed conveyor Demensions:1000*700*750(mm) Wave soldering machine in feed conveyor PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Product description: Wave soldering machine in feed conveyor , Demensions:1000*700*75
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
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