Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
and electronic sensing components and elect
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SMTnet Express, August 20, 2015, Subscribers: 23,363, Members: Companies: 14,574, Users: 38,793 Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly John McMahon P.Eng, Tom Blaszczyk, Peter Barber; Celestica Corporation
