Electronics Forum: entek and life (Page 7 of 10)

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69

We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 21:35:22 EDT 2002 | ianchan

Hi mates, 1) Firstly, thanks for everyone's reply to this thread. Cheers! 2) Secondly, Hussman69: sure u dun mean that blokes' tie was too tight? musta cut off his blood flow and oxygen?!? 3) Thirdly, we checked with our paste supplier, and they r

SMT line expansion - new oven and selective solder

Electronics Forum | Mon Feb 24 17:10:53 EST 2020 | kylehunter

> It looks like one oven is 10years newer than the > other, so if we assume same maintenance routine > you should get another 10 years if life on it. On > the TH side, you know your board complexity - for > me wave have much more

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook

| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup

| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi

Re: Wave Soldering 14 and 16 Pin SOICs

Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega

| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce

Common cleaning agent for Water soluble, No-Clean and RMA paste

Electronics Forum | Tue Oct 09 12:23:07 EDT 2001 | Mike Konrad

Hi Danial, Yes, you can use one cleaning chemistry for all paste types. There are many available chemistries from many manufacturers. The chemistries that I would recommend include: StencilWash Plus from Aqueous Technologies http://www.aqueouste

Is there a medical rating and standards for PCB components

Electronics Forum | Wed Aug 07 08:49:35 EDT 2002 | davef

What do you want to be certified? So, do you have a specification control drawing for each component that defines your expected performance capabilities for use by your buyer in acquiring these parts? If there is a reason to fabricate parts to your

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f


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