Electronics Forum: exposed copper acceptability (Page 7 of 25)

High Freq. RF grade ceramic filled PTFE PCB material

Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef

Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff

Re: PCB Standards

Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon

| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over

Re: Stupid follow-up

Electronics Forum | Fri Aug 21 12:54:21 EDT 1998 | Tryin' and Learnin'

HASL: (hot air solder leveling) is a process used to cover the Cu. Either Sn/Pb is used or Ni/Au or some other combo. In one case you create a land pad and in the other (with resin)you cover the Cu so that you only have a "trace." Is that correct so

Solder in via holes causing printing problems

Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef

On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte

BGA void removal

Electronics Forum | Mon Sep 30 20:41:25 EDT 2002 | jason

Hi, The acceptance level for voids is 25% and most of it on your case should be the paste. If you want to reduce / eliminate it, you gotta have the Production to practise FIFO for the usage of the paste. If it is expired paste or exposed to long

Paste life span on the printer

Electronics Forum | Wed Mar 14 09:07:34 EST 2001 | blnorman

We just ran a study to try to determine this. We exposed the paste to 85% humidity to simulate worst case manufacturing. At various times we removed the paste from the chamber and tested it for tack, solder balling, wetting (copper coupon), and vis

Alternate surface finishes

Electronics Forum | Fri Jun 18 12:50:32 EDT 1999 | jseagle

We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have inform

Re: PCB Mask repair

Electronics Forum | Thu Apr 02 12:21:56 EST 1998 | Justin Medernach

| I am looking for a product to repair PCB mask (seal exposed copper) and fill Gouges in pcbs, any suggestions? Mike, They sell all sorts of reparation kits for this type of problem. Liquid mask can come in many forms. The easiest to use is probabl

Panel/Pallet Separating with Interconnects

Electronics Forum | Sat Jul 13 09:00:44 EDT 2002 | davef

One of those pick your poison things, eh? * Reduce tester time and labor versus not testing the board after seperation from the panel * Traces that connected to the common bus will have exposed copper after seperation from the panel. This is not rec

SMT with NO soldermask? selective plating...

Electronics Forum | Wed Aug 27 09:23:03 EDT 2003 | Darrow Gervais

I have an SMT application in which I would like to eliminate the soldermaks layer. I am working on a VERY tightly packed board so I cannot bury the traces and connected them to the pads with vias. I was thinking about selectively plating the expose


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