Electronics Forum | Mon Jul 26 15:25:27 EDT 1999 | APE South, Jack Reed, Asian Sales Administrator
Dear Mr. Park, Ahn yahn haseo and good day to you. If you are currently in Korea, APE has a direct representative there, Omni-Create in Seoul who can give you full information on BGA reball kits available. Essentially, reball kits are custom made t
Electronics Forum | Thu Feb 08 14:03:39 EST 2007 | dave
Hi All, What is the cause of BGA tilt ? I have a failed board and it seems to have approx 0.25 mm difference in height on one edge of the BGA to the other. It is notable under magnification. Is this caused by to much time above reflow temp or not
Electronics Forum | Wed May 04 22:04:55 EDT 2005 | davef
First, you cannot determine if this is "black pad" by looking at it. You must do laboratory analysis, either microsectioning or EDS. [But it sure sounds like "black pad."] Second, if it is black pad, it was created by the company that fabricated t
Electronics Forum | Thu Dec 01 14:47:25 EST 2005 | Amol Kane
Hi, I am testing some lead-free assemblies using ATC. it was suggested to me that if i do in-situ testing, then i should measure the starting resistance, and subsequent resistances values after n cycles, and when the resistance value increases by 1 o
Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg
We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa
Electronics Forum | Mon Jan 06 23:25:29 EST 2003 | Dreamsniper
I made an experiment with our semi-auto stencil printer and used my naked eye to decide whether the alignment and deposition is pass or fail. I based the results in percentage and 100% is perfect result. Now here's the question: Can anyone tell me w
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Mon Jul 24 13:45:14 EDT 2006 | samir
Most Test Technicians, Managers, and everyone else in the organization always believe that the BGA is the #1, and most likely failure mode in a circuit. You can analyze it with all the tools available...2D, 3D, 10D, underneath, etc...... convince th
Electronics Forum | Wed Nov 04 07:53:56 EST 2009 | tstrat
The phosphorous concentration was not elevated w.r.t. levels needed for black pad syndrome. It is not via-in-pad. The component on the board that has been failing is just a standard BGA.
Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj
We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at
