Industry News: flip and chip and tombstone (Page 7 of 11)

Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan

Industry News | 2023-08-29 07:11:55.0

Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.

Indium Corporation

VJ Electronix to Feature Summit 1100 and Vertex 130 at SMTAI 2009

Industry News | 2009-09-17 16:35:17.0

September 2009 — Littleton, Massachusetts — VJ Electronix, Inc. announces that it will exhibit its Summit 1100 rework system and Vertex 130 in booths 303 and 305 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

VJ Electronix

Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010

Industry News | 2010-10-01 01:05:06.0

Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Finetech

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Industry News | 2012-08-02 11:15:11.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.

Hesse Mechatronics

KYZEN to Exhibit at the 16th Philippine Semiconductor & Electronics Convention and Exhibition

Industry News | 2019-05-20 19:09:05.0

KYZEN will exhibit at the 16th Philippine Semiconductor & Electronics Convention and Exhibition (PSECE), scheduled to take place May 30-June 1, 2019 at the SMX Convention Center in Pasay City, Manila. The company will showcase its AQUANOX A4727 Next Generation Aqueous Assembly Cleaner and MICRONOX® MX2322 Solvent.

KYZEN Corporation

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

Industry News | 2019-07-15 14:35:27.0

(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

YINCAE Advanced Materials, LLC.

Unicomp will showcase latest X-ray and 3D CT AXI during Productronica China 2021

Industry News | 2021-03-04 03:51:49.0

The Productronica China will be held at the Shanghai New International Expo Center from March 17-19, 2021.

Unicomp Technology Co., Ltd

KYZEN to Present "The Relationship Between Cleanliness and Reliability/Durability" at SMTA China East Conference

Industry News | 2021-03-30 11:46:31.0

KYZEN is pleased to announce that Daniel Gao, Sales Manager – Northern and Western China, will present during the SMTA China East Conference on April 22, 2021. Gao will present "The Relationship Between Cleanliness and Reliability/Durability."

KYZEN Corporation

Unicomp LX2000 AXI X-Ray equipment are widely applied in Electronics and Semiconductor Industry

Industry News | 2021-07-29 05:26:00.0

Unicomp LX2000 AXI X-Ray equipment are widely applied in Electronics and Semiconductor Industry

Unicomp Technology Co., Ltd

Unicomp Present X-ray Technology in NEPCON NAGOYA and Automotive World NAGOYA 2021

Industry News | 2021-10-25 04:43:59.0

The 4th NEPCON NAGOYA and Automotive World Nogaya will be held at the Portmesse Nagoya, Japan from October 27th to 29th 2021, which is Japan's leading exhibition gathering the latest technologies and products for electronics R&D and manufacturing such as SMT mounters, AOI, SPI, testing equipment including X-ray and 3D CT AXI Inspection Machine , electronics components, materials, PCBs, and Automotive Die-casting parts, etc.

Unicomp Technology Co., Ltd


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