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CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008

Industry News | 2008-04-07 21:53:22.0

MINNEAPOLIS - December 20, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in the West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at ExpoElectronica in Moscow.

Industry News | 2008-04-08 23:15:05.0

MINNEAPOLIS - April 2008 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in distributor AssemRus booth number 13 Hall 104 at the upcoming ExpoElectronica exhibition and conference, scheduled to take place April 15-18, 2008 at the Crocus Expo, Moscow.

CyberOptics Corporation

CyberOptics to Exhibit SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2009

Industry News | 2009-03-23 13:24:38.0

MINNEAPOLIS - March 2009 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will showcase SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

CyberOptics Corporation

ORPRO Vision SPI Presentation

ORPRO Vision SPI Presentation

Videos

ORPRO Vision SPI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion P36 Plus SPI system. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision

Orpro Vision GmbH

Vitrek LLC

Industry Directory | Manufacturer

Vitrek provides safety/electrical test equipment, high-speed data acquisition and real-time RF recording & playback solutions to industries including electronic/appliance/automotive/medical/aerospace/military.

Vi TECHNOLOGY®'s component inspection solutions to reduce defective PCBAs @ Nepcon Shenzhen 2010

Industry News | 2010-08-09 13:23:20.0

Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.

Vi TECHNOLOGY

SE600™ High Performance 3D SPI

SE600™ High Performance 3D SPI

New Equipment | Inspection

Ultimate Precision Accuracy With World-Class Usability. The SE600™ – CyberOptics’ flagship SPI system, is the most advanced, high performance system ever. SE600™ brings together best accuracy and world-class usability on a single platform – making i

CyberOptics Corporation

VisionPro M500 - Benchtop 3D SPI

VisionPro M500 - Benchtop 3D SPI

New Equipment | Inspection

The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found withi

ASC International

SE500ULTRA™ High-Speed 3D SPI

SE500ULTRA™ High-Speed 3D SPI

New Equipment | Inspection

World-Class Accuracy At Fastest Speed. The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor. An all-new, improved ultrafast sensor c

CyberOptics Corporation

SE500-D™ Dual Lane 3D SPI

SE500-D™ Dual Lane 3D SPI

New Equipment | Inspection

80 cm²/sec with zero compromise on measurement accuracy and repeatability. With SE500-D™ you can maximize production utilization and transform your production process to achieve high quality solder joints through accurate volume measurement of solde

CyberOptics Corporation


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