Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Mon Nov 26 15:30:35 EST 2001 | jhingtgen
To all, For the benefit of everyone there will be a session conducted at APEX on this topic. I have included the information that I pasted from the APEX website (http://www.goapex.org). ADHESIVE PRINTING Chris Marinelli, Loctite Tuesday, Janua
Electronics Forum | Sat Mar 31 08:22:42 EDT 2007 | davef
Are you observing stencil design rules with regard to aspect and area ratios? For more: * IPC-7525 - Stencil Design Guidelines * A previous discussion http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24848 * Other postings on stencil ratio
Electronics Forum | Mon Mar 07 11:20:10 EST 2005 | mrduckmann2000
Russ, I tried to get a screen for glue but the design engineer who laid this board out made up his own rules. The 0402 pads are to close for a proper dot size.....per the stencil house. That is why I am going the solder mask route. I would rather
Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar
Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h
Electronics Forum | Wed Aug 07 05:08:04 EDT 2002 | matherat
This sounds like it could be a SIPAD solid solder application. Bring the boards in with the solderpaste already on them in a flattened solid form. Then you could print glue on them without disturbing wet paste. 1.Print glue. (Might take a little
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Thu Nov 19 01:56:01 EST 2009 | lococost
Thanks dave, We have our problem down to the stencil (printer). We are unaware of any design rules concerning aperatures on glue stencils, does anyone know of any?
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