Electronics Forum | Tue Aug 03 14:39:11 EDT 2004 | russ
It is great for single sided boards, but you will have to use a glue/wave process or something else for second side assemblies. Russ
Electronics Forum | Wed May 11 09:07:46 EDT 2016 | SN
We are facing SMT components No solder and solder bridging issue (Glue PCBA) at wave soldering process. Fine tuned the wave parameters improved but not able to eliminate the issue. Suspecting because of moisture pad and component leads contaminated d
Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
Electronics Forum | Tue Dec 15 22:23:52 EST 1998 | Erhan Kaya
If that's what you mean, here's what we call them: ROBBER PADS... Pretty close to the "thief" I guess. Those come with the design and if the wave soldering direction is not known at the time of design and/or there's no real estate limitation, the rob
Electronics Forum | Tue Mar 11 11:22:38 EST 2003 | slthomas
Is a water-soluble flux based paste an option for the bottom side? Then you could wash the residues from the board before wave. That's the only way we've tried that process. The difficulty we had was with some disturbed joints, apparently from s
Electronics Forum | Tue Mar 11 10:19:00 EST 2003 | yngwie
We ran doublesided SMT thru Glue and Wave process before and but faced a lot of skip solder. Then the customer told us that they have similar problem when they ran the board so what they did was they print the paste-dispense the glue- place the comp
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Thu Apr 26 16:55:31 EDT 2007 | ratsalad
I am guessing Theresa is saying when that some SMT parts are soldered (not glued) very close to some PTH parts. So close that they can't effectively mask the SMT parts and have an opening for the PTH part. At the company where I work, we've been tr
Electronics Forum | Wed Feb 23 16:25:33 EST 2000 | John
We are using a glue and wave solder process for primarily chip components. Our products do not use any fine pitch components. What would an acceptable benchmark for the placement defect rate be? 50 DPMO? 100 DPMO? 200 DPMO? Thanks in advance,
