Industry News | 2015-06-12 11:41:24.0
CHATSWORTH, CA – May 18, 2015 – NATEL Engineering Company, Inc. and OnCore Manufacturing, LLC announced today that the merged company will be named: NEO Technology Solutions (NEO Tech). The name NEO Tech captures and combines the company’s legacy members; NATEL Engineering, EPIC Technologies, and OnCore Manufacturing, while creating a name on which to build a brand.
Industry News | 2015-06-12 11:38:23.0
Combination Creates One of the Premier EMS Companies in the Mid-Tier Space
Industry News | 2002-02-27 07:55:33.0
Plexus Corp. (Neenah, WI) has signed a licensing and services agreement with Tessera Technologies Inc. (San Jose, CA). The licensing agreement enables Plexus to use Tessera's chip scale packaging (CSP) and multi-chip packaging (MCP) solutions to develop and manufacture miniaturized electronic devices. In addition, Tessera will provide Plexus with design collaboration, technology support, technology transfer, and sales and marketing assistance to accelerate their customers' time to market.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2013-12-09 18:06:26.0
Cogiscan and Speedline Technologies today announced that the companies have entered an OEM relationship under which Cogiscan will provide software to harvest and report traceability data from Speedline printers.
Industry News | 2002-11-18 11:47:42.0
William McLean, a 20-year veteran of the semiconductor industry and most recently President of U.S. Operations at ParthusCeva, was today named CEO and President of Anadigm�.
Industry News | 2017-08-10 18:04:34.0
Cogiscan Inc. announces the appointment of Technica, U.S.A. as its sales representative throughout Northern California, the Pacific Northwest and the Mountain States.
Industry News | 2020-03-12 06:20:11.0
STI's Mark McMeen, VP, Engineering Services, will have a special presentation on How does one collect "Objective Evidence" to meet the new J-STD-001 Section 8.1 on electronic assembly cleanliness? The presentation take place at STI Electronics Inc.'s facility in Madison, AL on March 26, 2020 at 3 p.m. and will explore why this IPC standard came about and why the current "ROSE" test methodology is not enough for today's advanced designs. It will explore different tools and techniques as well as discuss how to gather objective evidence needed to meet the specification. There will be an actual demonstration of the equipment and test reports that are generated by the SIR test equipment along with the actual hardware that generates the test data that supports "Objective Evidence" for review. Do you know how "clean or dirty" your electronic manufacturing process and resulting hardware/assemblies are at completion?
Industry News | 2017-11-08 07:18:03.0
XJTAG, a world leading supplier of boundary scan technology and Systech Europe, a leading European provider of electronic test solutions, today announced the availability of an integrated solution using XJTAG boundary scan and Takaya’s flying probe system.
Technical Library | 2022-06-27 16:50:26.0
Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.
