Electronics Forum | Fri Feb 17 09:35:00 EST 2006 | Rob
Hi, I take it you are refering to intrusive reflow? It came around as more components became available in surface mount packages leaving mainly connectors left over for a separate insertion operation & wave/selective/hand solder. Manufacturers imp
Electronics Forum | Tue Jul 19 18:05:31 EDT 2016 | davef
I'm not real clear on what you're looking to understand, but let me get things started ... IPC-A-610F - Acceptability of Electronic Assemblies, 7.3.3 Supported Holes – Wire/Lead Protrusion Minimum length: You need to be able to discern the compone
Electronics Forum | Wed Feb 15 21:49:40 EST 2006 | Jose Luis Mendoza
Hi there,, Im looking for information about history and evolution of the PIH process. I will use this information for the state-of-the -art in my Master.D tesis project. Any information will be appreciate! Regards. Jos� Luis Mendoza ITESM
Electronics Forum | Fri Feb 17 19:36:09 EST 2006 | mika
You can also take a look at http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9902&mc=2 /Mika
Electronics Forum | Wed Feb 15 21:54:07 EST 2006 | Jose Luis Mendoza
Hi there,, Im looking for information about history and evolution of the PIH process. I will use this information for the state-of-the -art in my Master.D tesis project. Any information will be appreciate! Regards. Jos� Luis Mendoza ITESM jlmen
Electronics Forum | Thu Jun 10 19:10:05 EDT 2021 | kojotssss
Hi, Get your account. https://software.indium.com/stencil-coach/pin-in-paste-apertures.php
Electronics Forum | Tue Jul 28 16:13:45 EDT 1998 | Steve Gregory
| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at
Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Fri Oct 19 18:30:05 EDT 2012 | hegemon
When using AOI for through hole you can expect to be able to detect, depending upon whether inspecting from the solder side or the destination side: Polarity (if applies) Value (if marked) Presence (should be there) Non-Presence (should NOT be there)
