Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Electronics Forum | Thu Jul 20 13:57:04 EDT 2000 | Boca
I am not answering for Techguy2000, but I am chiming in here, I have the same problem. Our resistor packs are ceramic body with no leads, they have a metalized area reminicent of the old castelation leads of year gone by. The lead pitch is 50 mil
Electronics Forum | Tue Jul 16 21:53:51 EDT 2002 | davef
We don't use Sn43Pb43Bi14 solder. We don't make high performance circuit boards that are subjected to temperatures from -55� Celsius to +85� Celsius and vibration requirments at 6g. We don't like bismuth solder alloys, because: * Fatigue life is r
Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef
This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa
Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef
Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on
Electronics Forum | Fri Aug 20 14:22:02 EDT 1999 | Earl Moon
| | | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | | Can any one tell me what I have to change in my SMT | | | process (paste, reflow, etc) If any? | | | I
Electronics Forum | Fri Aug 21 14:29:37 EDT 1998 | Earl Moon
| HASL: (hot air solder leveling) is a process used to cover the Cu. Either Sn/Pb is used or Ni/Au or some other combo. In one case you create a land pad and in the other (with resin)you cover the Cu so that you only have a "trace." Is that correct s
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
Electronics Forum | Wed Feb 26 13:26:24 EST 2020 | rgduval
I'd agree with getting a stencil fully cut, and taping the pads you don't want paste on. But, I'd also check with the people that will be doing the hand soldering to see what they prefer. Some people prefer soldering on bare pads, some prefer solde
Electronics Forum | Wed Sep 01 12:26:32 EDT 1999 | Jae Hinson
To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has anyon
