PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2590&OB=ASC.html
: many DFN packages are less than 2.00 mm long and the pad size is 0.50 X 0.65 mm. Very small pad and the pad shape needs to be the same as the terminal lead shape for the best solder result as the pad and terminal lead size are 1:1 (same size
| https://www.eptac.com/soldertips/soldertip-44-ipc-guidelines-for-flux-selection-and-use/
: We must select a flux, which will help solder the product, but won’t be a problem once the product gets out into the field. Basically you want your flux to do three things, prepare the surfaces to be soldered, keep it protected from reoxidizing during the soldering operation and get out of the way when the solder comes along
| http://etasmt.com/cc?ID=te_news_bulletin,19361&url=_print
. Remove metal oxides and certain contamination from the metal and solder particles to be bonded. 3. When the temperature continues to rise, the solder particles first melt separately and begin the process of liquefaction and begin to form solder joints. 4
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6
| https://www.eptac.com/soldertips/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
: The Cleanliness of Wire and Terminal Connections Question : What are the specifics on wire and terminal connection cleanliness requirements and how do they compare to PCB cleanliness? Answer
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-tip-flooding-to-remove-leaded-solder
Solder Tip Flooding to Remove Leaded Solder - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/dispense-tips?con=t&page=2
, adhesives, grease, MEK, paint-based inks, solder… Nordson EFD Explains How to Choose Dispensing Tips in New Series of Educational Videos Nordson EFD Videos help viewers learn quickly and easily how to select the right dispensing tip for a particular
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/dispense-tips?con=t&page=19
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| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-40-component-mounting-and-acceptability
. To keep the component flush to the board could also be an issue. Please check 7.1.4 Hole Obstruction on page 7-12, which may be a problem when considering the solder joint and such