Technical Library | 2017-05-31 18:19:44.0
These guidelines give the assembly team a standardized, no-nonsense method to produce a reliable panelization solution. By eliminating panelization guesswork, you ensure successful assembly even for complex projects.
Technical Library | 2001-05-23 16:34:10.0
Consultant R. Michael Donovan asks, "Do you really provide what your customers want and need?" He contends that companies who continuously excel at customer service will gain more marketshare. Mike provides his reader with 10 questions that can help an organization assess its customer service performance, progress and opportunities for improvement.
Technical Library | 2012-12-12 03:17:51.0
When we designed the PCB equipments, we should try to simplify crcuit and structure design that on the premise of ensuring the equipments to meet the technology and performance, In modern society, modules design (MD)is a effective measures to improved the pcb equipment reliability. The system were made up simpleness functions of modules to reducing the complexity of the design. Both domestic and abroad, a large number of facts have proved this point, MD was a best choice for PCB equipment design.
Technical Library | 2023-10-19 22:03:14.0
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, proudly releases another customer success story with Matric Group. This case study shows how Matric Group has leveraged their partnership with Koh Young to be one of the first in the industry to use pre-reflow AOI as a game-changer for line efficiency and improved yield. All while creating a central inspection war room to allow just one person to manage all inline inspection, increasing automation, and control and mitigating talent shortages.
Technical Library | 2018-03-15 07:23:35.0
The SMT assembly process is continuously challenged by the factors which enhance circuit board performance and limit productivity. The pick and place and reflow systems reflect these driven issues by adding more and more controls to their systems, but the fact is one of the age old processes continues to operate within the same rules since the dawn of the SMT assembly world: The SMT screen printing. (...)This paper showcases a new stencil process that was discovered by reverting to the basics:understanding the reason for each stencil material process, focusing on detailed finishes and a disciplined aperture design process, maintaining original designs, and making the correctly designed apertures to control the paste deposition. The test results drove us to focus the efforts on the aperture walls In this paper we will demonstrate with lab tests SMT process results howthe improved paste release results in improved SMT print process performance and its positive impact on SPI yields and EOL performance.
Technical Library | 2016-06-23 13:24:56.0
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.
Technical Library | 2019-03-13 15:19:55.0
It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide, there is also a cost. As PWB assemblers work to justify the return on investment, one key question continues to arise. What is the durability or life of these coatings and what can be done in the print process to maximize the life of the coatings?This paper addresses durability of the coatings in relation to the number of print cycles and underside wipe cycles applied as well as materials used on the underside wipe process. Different parameters will be applied and data will be collected. The results of this study will be summarized to help those using or considering the use of these nano coatings to improve their print process and suggestions will be given to maximize the life of the coatings.
Technical Library | 2022-01-26 15:26:56.0
In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity.
Technical Library | 1999-05-06 10:30:06.0
Augmentation of extended surfaces used to dissipate heat increases the overall effectiveness of a heat sink and increases the heat removed per unit volume. This amount of increase depends on the number of augmentations, air flow velocity and ...
Technical Library | 2011-08-04 19:29:53.0
This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and
