Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Wed Jun 24 14:08:34 EDT 1998 | Henry Lee
I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will solder
Electronics Forum | Thu Jun 25 08:30:39 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Mon Jun 08 11:39:28 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Mon Mar 12 08:24:30 EDT 2007 | rgduval
ICT is generally a manufacturing verification test. Coverages vary depending on the board. I've run lots with as low as 25% coverage on the board (but produced 98% FPY post board assembly). Functional test is exactly what it sounds like. Checking
Electronics Forum | Mon Mar 12 08:06:44 EDT 2007 | davef
Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? A1. Nothing is mandatory. You do ICT to prove some component functionality and check manufacturing process. ICT test coverage is driven by factors i
Electronics Forum | Fri Aug 08 11:37:09 EDT 2008 | pjc
Yes, sure. In fact in some applications ICT is coming back. Mainly due to the fact that more and more SMT discrete components have no markings, so AOI cannot tell you if you have the correct value on the PCB. Fixed pin or flying probe ICT is a valuab
