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Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements

Technical Library | 2017-07-13 16:16:27.0

Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.

Alpha Assembly Solutions

Characterize and Understand Functional Performance Of Cleaning QFN Packages on PCB Assemblies

Technical Library | 2022-12-19 18:59:51.0

Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.

iNEMI (International Electronics Manufacturing Initiative)

PCBA Cleanliness End-of-Project Webinar

Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,

PCBA Cleanliness End-of-Project Webinar

iNEMI (International Electronics Manufacturing Initiative)

Specialty Coating Systems Debuts New-Generation Omegameter SMD 650 Ionic Testing System

Industry News | 2017-10-11 17:23:58.0

Specialty Coating Systems (SCS) announced today the launch of the Omegameter SMD 650, the next-generation, software-controlled Omegameter ionic contamination test system.

Specialty Coating Systems

SCS Releases New Ionograph® Contamination Test Systems

Industry News | 2015-02-02 18:32:12.0

Specialty Coating Systems (SCS) introduces the new Ionograph® SMD V and Ionograph® BT Series (bench top) contamination test systems. The redesigned SCS Ionograph SMD V is the latest in SCS’s line of ionic contamination test systems and the SCS Ionograph BT Series is a redesign of the current I500M Benchtop Ionographs.

Specialty Coating Systems

Aqueous Technologies Presents Next Installation in E-Learning Video Series: Zero-Ion G3 Ionic Contamination Tester

Industry News | 2009-04-23 20:43:27.0

RANCHO CUCAMONGA, CA � April 2009 � Aqueous Technologies Corp. announces the publication of its newest video presentation, �An Introduction to the Zero-Ion G3 Ionic Contamination Tester.�

Aqueous Technologies Corporation

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

IONOX® I3955 - Vapor Cleaning Solvent for Electronics

IONOX® I3955 - Vapor Cleaning Solvent for Electronics

New Equipment | Cleaning Agents

IONOX® I3955 is a precision vapor cleaning solvent designed as a drop in replacement for modern era vapor degreasing equipment. IONOX® I3955 is effective in removing no clean and rosin flux residues from electronic assemblies including low stand-off

KYZEN Corporation

Austin American Technology HydroJet® In-Line Cleaning System-24

Austin American Technology HydroJet® In-Line Cleaning System-24

New Equipment | Cleaning Equipment

The HydroJet Washes with Chemistry or Water in One Machine! Durable Construction The HydroJet   in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life.  It has a non-corroding, rigid metal chas

Austin American Technology


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