Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano
3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to
Electronics Forum | Wed Feb 08 11:46:19 EST 2023 | tommy_magyar
Yes, your statement is correct. J-STD-033B.1 section 5.3.3.2 SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet, maintained at not greater than 5% RH. Storage in these dry cabinets may be considered equivalent to storage in a
Electronics Forum | Fri Feb 10 05:34:55 EST 2023 | ysundar71
Thanks for the comments. As per D Revision of J STD033, clause 5.3.3.2: Dry cabinet at 5% RH SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet, maintained at not greater than 5% RH. Storage in these dry cabinets may be consid
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts
What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first
Electronics Forum | Mon Nov 27 12:17:02 EST 2000 | Dason C
Chris, you are not completely right. Our industrial is following the IPC standard as our guideline. Per IPC J-STD-033 has specify the floor life at para. 8 (normal condition at 30C/60%RH). If Victor can control his environment at 32% then the compo
Electronics Forum | Tue Sep 19 11:28:09 EDT 2000 | Wolfgang Busko
Mikeal�s approach is one of the more cautious ones. IPC/JEDEC J-STD-033 clause 8.6 talks about 200�C body-temperature not to be exceeded and how it�s best measured. If you go for that method and you made sure that in your wavesoldering (that�s what
Electronics Forum | Fri Jan 04 15:34:49 EST 2002 | fmonette
As Dave mentioned we have put together a MSD audit checklist to insure that your internal procedure is complete and in line with J-STD-033. It's a free download at http://www.cogiscan.com, click on Moisture Sensitive Devices to access the MSD Knowle
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
Electronics Forum | Thu Jun 20 04:53:13 EDT 2002 | hany_khoga
Thanks Dave but unluckily my sweet BGA�s are surrounded by plastic connectors with hundreds of pins. Also my PCB�s are 4-layers so just thinking of doing what you suggest means ruining them for me. To be honest I tried bypassing the baking issue bef
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