Electronics Forum | Tue Sep 07 12:51:02 EDT 1999 | Brad Kendall
| | We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | | After wave so
Electronics Forum | Sat Aug 28 14:23:52 EDT 1999 | JohnW
| Hi There, | | Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have
Electronics Forum | Wed Aug 25 15:47:25 EDT 1999 | JohnW
| | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | Most common reason is uneven hea
Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Wed Aug 25 21:44:03 EDT 1999 | Jason Tomlinson
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Wed Aug 25 15:51:58 EDT 1999 | JohnW
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon
| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co
Electronics Forum | Wed Aug 11 15:48:54 EDT 1999 | JohnW
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Mon Aug 09 16:15:30 EDT 1999 | JohnW
| I am having cleaning problems when processing PCB's which have | TAIYO solder mask on them. After processing, hand soldering and | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other soldermasks
Electronics Forum | Mon Aug 09 18:03:28 EDT 1999 | Earl Moon
| | I am having cleaning problems when processing PCB's which have | | TAIYO solder mask on them. After processing, hand soldering and | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other solde
