Electronics Forum | Wed Mar 29 22:30:13 EST 2000 | cklau
Hi guys; There are a few points that should be taken in to considerations regarding IPC-SM-782 land pattern and design rules. As a general rule all SMT reflow pattern should be in comply with SM-782 but however for special cases like : * PLCC land
Electronics Forum | Tue May 28 09:08:52 EDT 2002 | pjc
Silkscreening is falling out of favor, as it should. SMT IC devices can have their "pin one" solder lands indicated by a round mark, like a fiducial or a "1" mark, both made from either the copper clad PWB material or silkscreened. I have seen some w
Electronics Forum | Wed Aug 23 17:45:57 EDT 2000 | JAX
Before the two of you get out of hand let me shed some light on the matter: Here's a little somthing to think about!! "If the Sun at its rising is like a crescent and wears a crown like the Moon: the king wll capture his enemy's land; evil will leav
Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach
| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme
Electronics Forum | Fri Aug 24 18:00:23 EDT 2001 | Marshall
Hi, I understand that solder joint shape and strentgth is dictated by land dimension / geometries. i have a pcb with 4-5 different land dimensions. My queries are: a) since all of them were tested, what will be the effect if I leave it that way whi
Electronics Forum | Thu Sep 06 01:12:43 EDT 2001 | Dreamsniper
Hi, What's the maximum track width that is allowed to be attached to a 0805 component land pattern. I have a 70 mil x 45 mil Land for my 0805 and is attached to a 50 mil wide track with a length of 300 mil to 1500 mil. Components affected are mostly
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Mon Jun 05 10:42:28 EDT 2017 | philc
I guess it all depends on volume. If you are talking thousands of PCB's, then automation is best, if possible. Otherwise, hand-soldering them post-production is the obvious solution. How about bill-boarding them? That way, they would fit on the land
Electronics Forum | Tue Jun 27 10:36:45 EDT 2000 | Bill Bannister
We've been experiencing solder balls on 0805 caps. We have modified the reflow profile and had some success, but some balling still persists. The balls always form from under the cap between the lands. I measured the distance between the lands at .03
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