Electronics Forum: material and he (Page 7 of 44)

Rohs and WEEE

Electronics Forum | Sat Jan 29 08:46:20 EST 2005 | davef

The RoHS Directive complements the WEEE Directive. * Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive [2002/95/EC] affects manufacturers, sellers, distributors and recyclers of electrical and electronic equ

Flexi boards and uBGA

Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG

We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w

Solder Balls and Humidity

Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics

This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of

Dye and Pry

Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon

ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that

PDBE and PBB replacements???

Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef

Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber

Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Tue Jan 05 20:29:32 EST 1999 | Steve Gregory

| A question for you all! | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Wed Jan 06 09:55:22 EST 1999 | Chrys

| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea


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