Electronics Forum | Sun Mar 04 11:15:41 EST 2007 | Jim
>We have looked at a few, and some use the removal time to >>calculate the placement time, which seems like a good idea. The problem with this method is that you can't develop an accurate removal/installation profile. You are removing a component a
Electronics Forum | Thu Nov 29 21:28:43 EST 2007 | hussman
Henkel Loctite makes a hot melt just for this. Do a web search on Loctite Hot Melt and you can see for yourself. Material comes in a variety of ways - we use the 10 inch sticks and their glue guns specially made for the material. Works well, is fa
Electronics Forum | Mon Jul 07 09:00:50 EDT 2008 | josh_brubaker
These images are of two melted matrix trays, full of BGA components, which were left to bake in an oven over the weekend. The oven temperature controller was not checked after a recent power failure and reached a temperature of 715�F. The two trays m
Electronics Forum | Tue Aug 25 10:25:56 EDT 2009 | grahamcooper22
Do you know the exact BGA sphere alloy make-up and the alloys melt temp ? Then you can judge the ideal reflow temperature. Also, does the package warp in the reflow zone ? This may be causing the solder spheres on the BGA to lift off the pcb and henc
Electronics Forum | Mon Aug 25 02:57:43 EDT 2014 | arjunkolavara
We are in the process of qualifying our SMT lines for the High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag.If any one has already an experience with this alloy,kindly do give ur inputs on the process of profiling . The reflow d
Electronics Forum | Mon Apr 09 02:57:16 EDT 2018 | robl
Hi, these are both power pins, usually connected to a dedicated inner VDD/VDDQ 1oz copper layer, making a very effective heatsink. I am guessing that not enough heat got to the ball to fully melt it, creating a weaker column rather than a beautifull
Electronics Forum | Mon Jun 15 16:51:05 EDT 2020 | emeto
Tin/Lead has 183C melting point and probably around 220 peak temperature at reflow. Tin has 232C melting point. I would assume that based on this information you would understand why intermetallic joint is questionable. Go to any flat finish. HASL wi
Electronics Forum | Thu Jun 14 21:09:44 EDT 2001 | davef
I bet ya box of Krisp Kremes our operators can melt insulation on wire better and faster that yours can!!! Aww, our operators can melt any insulation on any wire. It�s taken years of effort to develop the talent, but not matter what we bring in for
Electronics Forum | Tue Apr 29 09:43:30 EDT 2003 | davef
With a nickel barrier and 'tin' plating, reconsider your reflow recipe to reduce the leaching of the termination into the solder during reflow. Points are: * In designing a reflow temperature recipe, it is important that the temperature be raised at
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
