Full Site - : metal migration (Page 7 of 9)

Soldermask - sulfur presence

Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm

Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned

Flux Classifications.

Electronics Forum | Tue Mar 09 18:04:34 EST 2004 | davef

Obviously, if your customer instructs you to use a certain flux type, using THAT flux type is probably a good idea. Responding to your question: Chloride is one of the more detrimental materials found on printed circuit assemblies. Chlorides can com

External Factors to be controlled during assembly

Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef

All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d

omega meter

Electronics Forum | Wed Mar 06 21:16:17 EST 2002 | davef

�What does 5 micrograms of chloride mean to me?� * With SIR testing, you can show no detrimental leakage currents under humid conditions, no corrosion, no metal migration, which are the big factors in figuring out electrochemical reliability. People

Re: Contamination causing shorts.

Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian

| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the

adhesive on pads

Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef

Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco

Re: Criteria for the Omega Mete from Alpha Metals Inc.

Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F

Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Wed Jun 30 11:09:24 EDT 1999 | John Thorup

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.


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