Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo
A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Mon Feb 08 17:11:04 EST 1999 | chris arnold
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. Earl, Pallets can be extremely u
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
Electronics Forum | Mon Feb 26 20:22:01 EST 2001 | davef
As a design rule, provide 0.050" minimum between parts to be "masked" and areas that require wave contact. The more the better is the general rule to apply. Check: http://www.autogroup.com/designguideb/ http://www.spprecision.com/ http://www.datumdy
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Wed Jul 12 09:45:16 EDT 2000 | Charlie
The following are questions my boss has ask me to send out to you folks. This is done in an effort to see "What does the rest of the world do?" [if such a world could possibly exists, in the first place]. If you would select any or all questions to r
Electronics Forum | Thu Mar 13 15:17:03 EDT 2008 | slthomas
about WHY violating IPC design standards gives you grief? Do they even know they exist? We've got one in particular that seems to shoot from the hip. I want to tell them the "why" as well as the "what" so they'll be a little more proactive. My fee
