Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Electronics Forum | Mon Jul 15 15:02:55 EDT 2013 | island2013
In previous lives we vacuum sealed all MSD devices. Also a nitrogen chamber can be used for unsealed bags. You can check the J-STD-033 and J-STD-020A for handling of the different levels, bake times etc. Good Luck!
Electronics Forum | Mon Mar 22 07:59:42 EST 2004 | davef
Search the SMTnet Archives for suppliers of high temperature bake tubes, trays, and reels.
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Fri Jun 09 05:18:07 EDT 2006 | Rob
Hi Shawn, that you're baking the components makes me think that they are either old, or have been sitting around for a while (or none of the above & you are really dilligent!) Whilst baking will sort out the MSD issues (such as popcorning) it will
Electronics Forum | Mon Mar 08 22:04:19 EST 2004 | pari
Dave i know abt the JEDEC033A specs..but this question is more of PCBA level. The baking temp and time at JEDEC is for MSD devices. I have tried to check IPC 7711 but the criteria does not mention the baking temp and time. Wandering is anyone is awar
Electronics Forum | Thu Oct 25 06:45:52 EDT 2012 | mccabekev
I have read through the IPC/JEDEC J-STED-033.1 standards regarding bake and storage of MSDs. The lowest bake in the standard is
Electronics Forum | Fri Aug 16 17:08:07 EDT 2002 | davef
Could be. It does indicate imperfection. * �The component was manufactured and shipped correctly and should not need baking in order to use it.� => Sounds good. Most classes of MSD packaging have a self-life. Lots of times it�s expired before it
Electronics Forum | Fri Jul 11 09:58:18 EDT 2003 | Chris
Good Day Everyone, We are a contract manufacturer. We are constantly receiving MSD components in consignment kits that are not sealed, not in the right bags or have no desiccant. When this occurs, we bake the parts per JEDEC J-STD-033A. We recently
Electronics Forum | Fri Nov 17 08:04:24 EST 2006 | jdumont
Morning all. I was wondering if there is a packaging standard (other than 033B) that we can put on our POs to vendors. We are seeing a lot of MSD components come in packaged incorrectly and do not have the man power to bake everything before it goes
