Industry News | 2008-04-08 01:17:22.0
OSAKA, JAPAN � March 4, 2007 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Impact Strength of Lead-free BGA Spheres,� to the 18th Shanghai International SMT High Level Conference that is part of NEPCON China 2008 which is scheduled to take place from April 8 to April 11, 2008 at Shanghai Everbright Convention and Exhibition Centre.
Industry News | 2012-08-01 16:44:06.0
Nihon Superior Co., Ltd. pleased to announce the establishment within the Faculty of Engineering, Architecture and Information Technology of the University of Queensland, Australia of the Nihon Superior Centre for Manufacture of Electronic Materials (NS CMEM).
Industry News | 2013-09-30 16:14:16.0
Balver Zinn today announced that it has been granted the right to sub-license the SN100C® patent by Nihon Superior Co. Ltd.
Industry News | 2009-03-01 22:13:07.0
OSAKA, JAPAN � February 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces Extra Fine Solder Wire SN100C (030) provides sharp spreading and good separation.
Industry News | 2009-07-28 11:43:13.0
OSAKA, JAPAN — July 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that a new presentation about the challenges and issues in lead-free soldering is now available on the company’s Web site.
Industry News | 2012-01-13 12:42:50.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium.
Industry News | 2013-10-09 15:53:27.0
Nihon Superior Co. Ltd.will sponsor the FIRST Robotics competition at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2019-10-29 15:52:14.0
Nihon Superior Co. Ltd. is pleased to announce the introduction of its new TipSave N flux-cored solder wire. The newly developed TipSave N flux-cored solder wire extends soldering iron tip life by 3X.
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
Industry News | 2013-07-29 14:03:36.0
Nihon Superior Co. Ltd will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection, and process yields.
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