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OK International will showcase assembly and rework technology advances at IPC/ APEX EXPO 2011

Industry News | 2011-03-17 17:48:27.0

The OK International team will display and demonstrate its full range of soldering and production assembly technologies at this year’s IPC/APEX Expo in Las Vegas, April 12-14. These industry-leading solutions will be fully operational at booth # 1634, including advanced soldering, desoldering and rework systems, programmable pre-heaters, fume extraction and a comprehensive range of dispensing technologies.

OK International

Christopher Associates' Jasbir Bath to Present during Technical Session at IPC Midwest

Industry News | 2011-09-14 11:38:51.0

Jasbir Bath, Consulting Engineer for Christopher Associates Inc./Koki Solder, will present “A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low-Silver Solder Alloys” at the upcoming IPC Midwest Conference & Exhibition.

Christopher Associates Inc.

Nihon Superior Debuts New Lead-Free Presentation

Industry News | 2009-07-28 11:43:13.0

OSAKA, JAPAN — July 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that a new presentation about the challenges and issues in lead-free soldering is now available on the company’s Web site.

Nihon Superior Co., Ltd.

PACE MBT 350 Multi-Channel Solder, Desolder & Rework System - Product Overview

PACE MBT 350 Multi-Channel Solder, Desolder & Rework System - Product Overview

Videos

The MBT 350, from PACE, is the standard that all other rework and repair systems are measured by. The system features PACE's exclusive IntelliHeat technology and can be used with 10 different handpieces. The MBT 350 has three handpiece channels tha

PACE Worldwide

Henkel Launches Next-Gen Underfill that has it All

Industry News | 2009-05-26 18:16:29.0

In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.

Henkel Electronic Materials

Acculogic Launches ThermoScan™ Test Technology

Industry News | 2010-09-14 17:17:30.0

Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, introduces its ThermoScan™ test technology. The ThermoScan™ sensor can be installed on a flying probe shuttle for general application or a probe module with Z-movement for more accurate measurement over the integrated circuits (ICs).

Acculogic Inc.

PDR Americas Announces Show Special on Rework Innovations and Technology at SMTAI

Industry News | 2016-08-31 19:08:27.0

PDR Americas announced today that it will exhibit at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase its best-selling PDR Model E3Vi Gold and offer several show specials in Booth #202. Additionally, PDR will hold a drawing for a portable Coleman BBQ grill (Roadtrip LXE). Show specials include:

PDR-America

Finetech to Exhibit at NEPCON China 2011

Industry News | 2011-04-20 16:31:45.0

Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.

Finetech

PDR Americas Releases PDR ThermoActive Suite Plus Rework Software

Industry News | 2016-09-08 13:16:47.0

PDR Americas today announces its latest upgrade – the new ThermoActive Suite Plus ‘dynamic profile software,’ signaling a new era in rework process control. PDR’s recently released advanced state-of-the-art smart algorithms and high-speed processing capability ensures the most exacting rework process control in the industry.

PDR-America

underfilling of bga

Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo

There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p


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