Electronics Forum: osp time to use (Page 7 of 33)

Small components sticking to nozzles

Electronics Forum | Thu Nov 03 11:31:51 EDT 2022 | proceng1

You described cleaning the spindles and filters, but did you clean the nozzles? Perhaps you got some paste on the nozzle. Also, did you perform the vacuum and blow off testing? Make sure your solenoids are working properly. Is it all 6 heads that

Help me to choose AOI-machine!

Electronics Forum | Wed May 15 08:06:09 EDT 2024 | james2024

Hi, It's not on your list, but we use an SPI and an AOI from SAKI. Very simple software interface and the same structure on all machines. As soon as the library is set up, a program can be created in a maximum of 20 minutes. The program creation go

software to produce assembly programs

Electronics Forum | Wed Nov 07 12:58:20 EST 2007 | Frank

I agree with Jon, that using Gerber data is a pain in the butt, but that doesn't answer your question about what software to use. CircuitCAM, VALOR, UniCAM (now Tecnomatix), and GC Place are the more popular third party software packages that deal d

soldering to thick gold plating

Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit

Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into

PCBA baking prior to rework

Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef

1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)

PCBA baking prior to rework

Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg

In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br

Alternatives to v-score or mouse-bites?

Electronics Forum | Tue May 11 18:59:36 EDT 2021 | rgduval

It's annoying, but, the last time I was faced with a similar issue, we ended up sanding the edge on the PCB after depanelization. I stronly recommend charging for this service. It could be sped up by using a Dremel fixed in a vice, but, I would cau

Time to retire the wave?

Electronics Forum | Sun May 27 04:18:22 EDT 2007 | grantp

Hi, We are currently soldering only connectors, so there is not that much to do. For the wave we currently use palettes as we solder PCI cards but don't want to wash. So the palette keeps the flux off the board. My reasons for looking at changing o

Small components sticking to nozzles

Electronics Forum | Thu Nov 03 02:16:55 EDT 2022 | spacecase

Hey I'm having an issue with a samsung 421f component placer. The machine is fine on the first 5 boards then on the 6th or so it just throws them wherever. The problem is the smallest flat components start sticking to the nozzle even after hitting th

ICT testing to improve yields

Electronics Forum | Mon Aug 27 08:57:39 EDT 2012 | cobham1

We are not a contract manufacturer we are in fact a OEM. our product is used for military systems. The reason no values are on the parts is because the orginal owner of the product did not want anyone to steal the values and make their own version of


osp time to use searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling Machine with CE

High Resolution Fast Speed Industrial Cameras.
Electronics Equipment Consignment

High Throughput Reflow Oven
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Global manufacturing solutions provider

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...


Internet marketing services for manufacturing companies