Electronics Forum | Thu May 14 01:14:08 EDT 2015 | m_imtiaz
i want to know what is the ideal viscosity of solder paste before printing. i have brookfield viscosity meter with Spiral Spindle.
Electronics Forum | Tue May 20 12:41:27 EDT 2008 | slthomas
We had some materials management brainiac insist that every component of a product had to have an exact quantity stated on the BOM so we had to weigh every board with and without paste printed. We rented a 4 place digital scale, weighed 5 of each boa
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Thu Dec 16 18:36:01 EST 2004 | mattkehoe
We use water soluble solder paste. When it gets a little dried out, can we add something to rejuvenate it? Liquid flux? We do not place components, just print and reflow the solderpaste so solderballs, spattering, and other issues like those are of
Electronics Forum | Wed Apr 28 09:15:15 EDT 2004 | smtpro
Yes we are using a 7 zone and a ramp to spike. How do you handle your solder paste and what printing methods do you use?
Electronics Forum | Sun Aug 19 09:27:09 EDT 2001 | davef
Yano, imalookinat two vendor specification sheets that say your paste should sit around at "print temperature" for 1 to 6 hours before printing [er, words to that effect]. Werejallgit this 6 hours stuff from?
Electronics Forum | Wed Jun 01 07:34:19 EDT 2005 | davef
It's unusual to use a horseshoe shaped pad for a 0805. Commonly when people want to reduce the paste volume to reduce solder balling, they print a "home plate" aperature. We print paste 1:1 with the pad. �IPC-7351 LP Wizard� is the library mainten
Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS
We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of
Electronics Forum | Wed Mar 23 11:40:21 EDT 2022 | SMTA-64388039
In my experience a distance of 30 mils per 1 mil in height above PCA nominal is sufficient for the squeegee blade to bend (in the direction of squeegee travel) so that you don't have excessive solder issues near the label. Labels are about 5 mils ta
Electronics Forum | Thu Apr 03 22:56:48 EDT 2008 | davef
Potential impacts of using expired solder paste are [University of Bolton]: * Changed paste rheology. Result: poor print quality * Loss of solvents. Result: reduced flux activity * Changed flux formulation. Result: More difficult to clean flux residu
