Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS
We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of
Electronics Forum | Fri Apr 27 11:24:53 EDT 2007 | realchunks
Hi Steve-O, Good question(s). This process was set-up by an engineer that had a PhD in statistics, took him a year to develop and then thru it over the wall at us. The biggest problem we saw was SPC to measure solder volume. SPC is good for measu
Electronics Forum | Mon Mar 27 10:26:59 EST 2006 | slthomas
It seems highly unlikely that you could actually trap enough air in your paste for it to be releasing air after you've worked it a few times unless it's not rolling properly to begin with. I suppose maybe a contaminant could be present that could b
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Mon Dec 22 20:16:17 EST 2008 | davef
The first question in solving the "ol' SMT component loss after second-side wave operation" problem is: So, what makes you think the components actually came-off in the wave and not during some previous 'handling'? Putting that aside, we'll play thi
Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam
Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V
Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms
Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid
Electronics Forum | Thu Nov 07 09:23:05 EST 2002 | russ
What would the considerations be in utilizing a type 4 paste as opposed to type 3? We have an assembly that has a large amount of uBGAs (12 mil diam pad)along with 50 mil pitch BGAs assorted fine pitch etc... We are experiencing difficulty in paste
Electronics Forum | Fri Nov 08 17:20:52 EST 2002 | davef
You need to get as much paste on the board as you can get. A BIG opening gives: * Better release. * More paste. You may be able to cheat further by rotating the square so that it is on the diagonal.
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