Electronics Forum: physics (Page 7 of 40)

DEK 265 mk1 Potentiometers

Electronics Forum | Sat Feb 01 10:46:51 EST 2020 | dekhead

I was trying to find pict / graphic of labeling for you; no luck yet... I haven't physically seen a MK1 for a few years.

Reason for Connector drop using chuck nozzle

Electronics Forum | Wed Feb 12 20:19:05 EST 2020 | nizar

Hi All, I have pick DIMM connector using chuck nozzle. Shape data already refer to physical size. Unfortunately, connector drop during pick up, and have many dislodge. Can we understand what might be the reason ?

Overview og possible nozzles for Fuji Aimex II

Electronics Forum | Tue Dec 21 13:02:21 EST 2021 | oclsc

Hi SMTnet. I looking for an overview of possible nozzles for Fuji Aimex II (H12HS and DX head). An overview with pictures of the physical nozzle tips and dimensions. Hop you can help me. Best regards. Ole C.

Drive Backups

Electronics Forum | Wed Feb 14 14:02:36 EST 2024 | mistrthou

Our IT company came in and did that for us. They used Acronis. Some of that software allows a a bootable USB to run over the computer's hardware rather than pulling the physical drive and plugging it into a laptop with another external drive.

Life of a Solder Stencil

Electronics Forum | Tue May 08 11:23:11 EDT 2001 | rwilliams

I have been tasked with determining the Life of a Solder Stencil and how to track it. (Basically, how do we know when to replace the stencil, E.g., deterioration of print quality, physical damage, etc.) Obviously there are a lot of variables, but is

CAD viewers, API

Electronics Forum | Tue Oct 02 22:13:56 EDT 2001 | davef

IPC-D-356 is a data transfer language developed by the IPC to replace Gerber. It is a far more intelligent form of physical definition for PCB/PWB. The only segment of the language that seems to have developed any market support is the physical netl

physical law of Dewetting

Electronics Forum | Thu Nov 01 05:30:06 EST 2001 | wbu

This is not about the physical laws but besides contamination, which will actually IMO cause NO WETTING, it is quite vital that the time-limit the flux is active is not exceeded during your reflow process. Depending on your paste/flux you will have a

Solder ball specifications?

Electronics Forum | Tue Jan 29 15:48:31 EST 2002 | davef

On his site "SMT In Focus", our friend Brian Sloth Blitzen lists the following sampling of lead-free [no lead] links: * Alpha Metals: http://www.alphametals.com/lead_free/index.html * Circuits Assembly magazine: http://www.circuitsassembly.com/db_ar

Wave soldering profiling

Electronics Forum | Wed May 12 12:01:11 EDT 2004 | solderpro

Now we are finally breaking the ice, glad to meet you greg, once again did not mean to offend any one and glad to have guys like you on the chemistry end of things... have no problem with the pp file, its mainly set up to help those with issues like

BGA rework

Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef

Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an


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