Electronics Forum: pin plating issue after soldering (Page 7 of 22)

Re: hybrid solder joints

Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.

| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil

Insufficient Wetting to Lands

Electronics Forum | Sun Nov 24 10:12:44 EST 2002 | kcorrin

Thanks for your response Dave. I did look at the bare boards after wave solder and they seem to solder fine in that process. I do not see any soldermask bleed on bare boards. Regarding "thin" plating...I have had issues in the past when the board sup

ENIG; Au < 0.5 um to avoid solder joint embrittlement

Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl

I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Thu Oct 14 10:49:13 EDT 1999 | Dan Woodward

Andrew, As I read about issues with reworking connectors, whether they are surface mount or PTH soldered, I wonder if compliant pin pressfit connectors are being considered. They are easily assembled after all SMT without any thermal input, and on e

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F

Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F

Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft

ENIG vs Flash Gold

Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris

Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b

"connector fell off"

Electronics Forum | Sat Apr 03 05:22:46 EST 2004 | wsanita

Customer returned a board and a 50 pin connector with .020" pitch that "fell off". after looking under a scope i can see the plating of the connector embedded in the solder. To me it looks like it broke off. Designer did not put the anchor pads on th

Re: wave solder bridges

Electronics Forum | Thu Jul 27 12:09:41 EDT 2000 | JohnW

Jason, where on the board is your connector?, front / back / middle? and where it on the PCB that you don't have issues with? Thief pad's are basically dummy pad's taht you have after the last set of pin's on the component are are used to draw the


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