New Equipment | Test Equipment
N7761A Main features Build-up time: 20 ms attenuation, 100 ms power 0.1 to 1000 dB/s attenuation conversion speed (optional) +23 dBm Input power 1.2 dB insertion lossPrice: $25000Price vary with options. Feel free to contact me for more details
New Equipment | Test Equipment
N7764A Main features Build-up time: 20 ms attenuation, 100 ms power 0.1 to 1000 dB/s attenuation conversion speed (optional) +23 dBm Input power 1.2 dB insertion lossPrice: $65000Price vary with options. Feel free to contact me for more details
New Equipment | Test Equipment
N7764A Main features Build-up time: 20 ms attenuation, 100 ms power 0.1 to 1000 dB/s attenuation conversion speed (optional) +23 dBm Input power 1.2 dB insertion lossPrice: $65000Price vary with options. Feel free to contact me for more details
New Equipment | Test Equipment
N7762A Main features Build-up time: 20 ms attenuation, 100 ms power 0.1 to 1000 dB/s attenuation conversion speed (optional) +23 dBm Input power 1.2 dB insertion lossPrice: $55000Price vary with options. Feel free to contact me for more details
New Equipment | Test Equipment
N7762A Main features Build-up time: 20 ms attenuation, 100 ms power 0.1 to 1000 dB/s attenuation conversion speed (optional) +23 dBm Input power 1.2 dB insertion lossPrice: $55000Price vary with options. Feel free to contact me for more details
Used SMT Equipment | In-Circuit Testers
Description The Agilent 8156A optical attenuator is ideal for making measurements on fast telecommunication systems. It is employed in R&D and production and is suitable for both single-mode and 50m multi-mode application. A variety of options for d
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Industry News | 2022-09-14 13:58:32.0
New Vishay Dale Series Delivers High Temperature Operation to 180°C Continuous with No Aging
Used SMT Equipment | In-Circuit Testers
Agilent 8163B Agilent/HP 8163B Lightwave Multimeter The Agilent 8163B Lightwave Multimeter is a basic measurement tool that provides flexible modular configuration and easy control of test solutions. This mainframe is used for optical component
