Electronics Forum | Wed Jul 15 08:36:41 EDT 2020 | dproldan
Using a X-Rays machine, we have noticed that one component we are using has the silicon die bonded at an angle in the package. Have you ever seen something like this? I'm not sure if it's intentional or a manufacturing error.
Electronics Forum | Wed Feb 09 17:52:24 EST 2000 | Jeff Woodruff
Look into an odd form placer. There are a number of manufacturer's out there, but it depends on the volumes that you are looking for to determine how cost effective. Odd forms can deal with bulk etc relatively easily....Buy a machine that is tailored
Electronics Forum | Thu Apr 12 02:57:25 EDT 2007 | poultorp
you might wanna look at the Valor (Trace Expert) program they support also the old Fuji's but it might be a "over kill" in this case http://www.valor.com/en/Products/Manufacturing%20Execution.aspx
Electronics Forum | Wed Jul 29 14:55:41 EDT 2020 | philc
Maybe check with the manufacturer? I am sure they would know if this was normal. And does the PCB function as expected? If it does, maybe not an issue....
Electronics Forum | Wed Mar 08 22:10:26 EST 2006 | pmperreca
Grant, let me suggest Nationwide Electronics, Inc. they are in palmetto,florida....941-341-9244 they are a independent distributor with ties to alot of different manufacturers. Ask for Dave or John. They will meet or beat most prices..if you give the
Electronics Forum | Wed Nov 09 05:44:06 EST 2005 | grantp
Hi, It sounds like your vision is not setup right for this component, and it's rejecting some of them because they would be failing the test. This brings up a point we discovered. Don't use auto teach for the component if your using HYDRA or vision
Electronics Forum | Thu Jul 22 12:02:52 EDT 2004 | lloyd
I'm currently having issues with a 28 terminal MLP package. I have only recently started in a new company and it seems as though the manufacturers guide lines as to pad geometry do not work (at least for us). So I now have a situation where I have 4
Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef
We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to
Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
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