Electronics Forum | Fri Jun 25 12:07:00 EDT 1999 | John Thorup
| | hello, | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | thanks for the input | | | | wayne | | | | | | | We have tried this mainly on thru hole connect
Electronics Forum | Tue Jun 04 12:26:40 EDT 2002 | Hussman69
If you have solder balls in vias on the "component side" it probably is your wave solder process. Most waves have an option that is designed to make sure your surface mount parts solder - but if turned up too high, can actually push solder up throug
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Tue Apr 17 13:33:00 EDT 2001 | Kris W
Howdy all! Nothin' up my sleeve!!! While attempting to reflow an RF antennae on std FR4, HASL coated, using no clean paste, in a Research Thermaflo 10, the part sometimes slides on one of the pads (as much as 0.125"). There is a slight amount of w
Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting
Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a
Electronics Forum | Fri Jul 10 15:27:10 EDT 1998 | John Bashe
50k chips each, which is equal to (5) 7" reels). These are the 2 main influences on practical machine efficiencies. Additionally, storage areas for component inventories can be significantly reduced in size. The never-ending drive to reduce the cost
Electronics Forum | Wed Apr 21 14:38:38 EDT 1999 | Justin Medernach
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces