Electronics Forum | Tue Mar 06 09:18:33 EST 2001 | davef
Two things: 1 Go to IPC and buy "TP-1115 - Selection & Implementation Strategy for A Low-Residue No-Clean Process - Provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concern
Electronics Forum | Tue Jul 24 07:57:55 EDT 2007 | davef
It sounds like the QFN component is not solderable. * Use ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * Contact your QFN component supplier for help * Consider a more active flux, since you might
Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Fri Jul 27 12:13:57 EDT 2007 | jdumont
We have issues with these also. They need to be flat to solder well. Reduce the square under the part for the heat sink and youll improve yields. That pad keeps the part lifted high while the other smaller joints reflow and partially attach. You can
Electronics Forum | Wed Sep 30 11:57:19 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Wed Sep 30 11:56:46 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Fri Jan 15 08:11:34 EST 1999 | Jim Nunns
Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK Regards Jim |
Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Fri Jan 15 15:29:03 EST 1999 | Jason Hall
| Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | Regards | Ji
