Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim
Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha
Electronics Forum | Thu May 22 00:21:27 EDT 2003 | AlCapone
The alternative is by looking at all your components data specs (heat-range), especially pay more attentions to heat-sensitive comps, and fine-pitch comps, odd-form comps, draw a diagram on a separate sheet of paper shown that temperature VS those ca
Electronics Forum | Mon Jun 16 14:39:49 EDT 2003 | stepheno
The second one is typical. The important temperature is the temperature of the joint, not the setting of the oven. The oven setting are only important because they determine the temperature of the joint. If you set the oven to 150, that will be th
Electronics Forum | Tue Jun 24 09:42:52 EDT 2003 | stepheno
The temprature for the first zone should be less as the PCB entering the oven from the ambient shop floor temprature would suffer a thermal shock from a higher temp. Experience must be gained from profiling a board with thermocouples, otherwise you
Electronics Forum | Thu Feb 03 12:21:15 EST 2005 | Chunks
Lets get to the simple things. Wave or Reflow? Wave soldered parts have a higher susceptibility to physical damage until they are waved. That�s were I normally see this type of break. Usually, the crack is a circular pattern in the cap if it�s fr
Electronics Forum | Mon Dec 26 10:45:40 EST 2005 | davef
+85*C. * Wave solder preheats are >100*C just prior to entering the wave * Temperature changes between exiting the chip wave and the laminar wave can swing through >100*C * Do not exceed 3*C per second maximum rate of change in temperature. Generall
Electronics Forum | Tue Jan 31 17:14:51 EST 2006 | Chris
I would not go by any general rules at all. Test the product! Thermal cycle it and shock and vib test it. Got burned on a part that had 0.010" dia bumps. Manufacturer stated undefill was not necessary on their part due to bump size. I wanted to u
Electronics Forum | Tue Aug 29 06:00:47 EDT 2006 | bwet
Ladies and Gents: There have been several studies including (http://www.solder.net/PDFs/LeadFree_BGATesting_InitialCycling_BEST.pdf) which have shown lower fast pass yields with solder paste. Based on internal projects of 1000+ of the same BGAs we a
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Wed Oct 10 08:01:28 EDT 2007 | ck_the_flip
We use Indium 1074-EXR on ERSA, and it's performed miracles on our yields. Spot soldering, like wave, is all about fundamentals. Put just enough flux, preheat to prevent thermal shock and activate the flux, and then solder with enough dwell time to
