Electronics Forum | Sun Oct 03 21:36:57 EDT 1999 | JAX
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Sat Jul 25 18:35:33 EDT 2015 | orbitcoms
I am looking for information regarding setting up an SMT assembly line. I have recently purchased a stencil paste printer, pick and place, and reflow oven. The main information I need is the paste selection and best finish material on the PCBs. I wil
Electronics Forum | Thu Jul 26 22:52:47 EDT 2001 | davef
GT 8 years ago every board saw "touchup". Touch was done to fix boards to conform to A-610. Now A-610 allows less than complete hole fill. Our operators were totally freaking nuts about touching boards. They touched each others touch and on and o
Electronics Forum | Tue Oct 14 09:26:15 EDT 2008 | bickt
Hi, I have been at both ends of this business. I installed lines and have been in manufacturing for some 25 years. Do not go by the test boards that the installer or OEM uses. these boards are too broad and loose for any kind of guide line to est
Electronics Forum | Sat Oct 18 08:17:40 EDT 2008 | hussman
Use a Cpk study on your screen printer. Deviation from print to print. Most reutable surface mount machine companies will supply you with their Cpp study they performed on your machine before they shipped it. On ovens use your profiler. You can
Electronics Forum | Sun Jul 26 05:56:28 EDT 2015 | spoiltforchoice
http://www.surfacemountprocess.com/solder-paste-printing-process.html this site has some pretty good general advice for the novice. I am in no way affiliated with it and I have no idea as to its eventual commerical aims (if any). ENIG if your produc
Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks
5 or 6 mil thicjk stencil and no reduction.
Electronics Forum | Fri Dec 28 17:02:04 EST 2007 | davef
We agree with Chunks
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
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