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Saki Demonstrates Advanced 3D AOI Capabilities at NEPCON China in Booth 1J25

Industry News | 2017-04-13 17:29:30.0

Saki Corporation will demonstrate the advanced capabilities and new extra component detection (ECD) feature of its BF-3Di 3D automated optical inspection (AOI) systems at NEPCON China on April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center in Shanghai, China, in booth 1J25.

SAKI America

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011

Industry News | 2011-09-21 12:22:09.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Nihon Superior Co., Ltd.

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

Yestech's AOI Role in Hazardous Area Instrument Manufacturing

Industry News | 2013-11-08 11:15:49.0

AOI can be a powerful tool when effective quality management becomes an absolute priority. Below, Andy Bonner, Managing Director at Cupio Yestech Europe demonstrates this with a look at BEKA associates, who are using AOI within their manufacturing operation producing display instruments certified for safe use within potentially hazardous areas..

Nordson YESTECH

Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover.

Industry News | 2018-08-06 05:59:56.0

Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover. The Nordson SELECT Selective Soldering Systems have been honoured with prestigious awards for innovation and excellence. With over 25 years experience in electronics manufacturing they’re proven both a highly experienced and a devoted team to perform flawlessly tailored products.Nordson SELECT have risen to become the foremost worldwide supplier of Selective Soldering Systems.

Gen3 Systems

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:17.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:21.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.

Nihon Superior to Highlight SN100C Products at SMTAI 2009

Industry News | 2009-09-17 15:06:04.0

OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.

Nihon Superior Co., Ltd.


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