Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2014-08-28 11:46:07.0
Nihon Superior Co. Ltd. announces that Keith Sweatman will present the paper titled ”Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold” at the upcoming SMTA International exhibition.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
New Equipment | Solder Materials
KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app
Industry Directory | Manufacturer
AGI is an Internationally known supplier of PCB Assembly Tooling. AGI manufactures wave solder pallets, SMT Fixtures, Kitting Carts and etc... for PCB Assembly. Let us help you with your tooling need
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
Brass Neutral Links manufacture and export 360 Brass CDA Neutral Links made from 360 Brass CDA material. 360 Brass CDA is a suitable for being joined by soldering, brazing, Oxyacetylene Welding, Gas Shielded Arc Welding, and Coated Metal Arc Weldi
