Electronics Forum | Wed Aug 23 15:19:11 EDT 2000 | Dr. Ning-Cheng Lee
From solder material point of view, a solder paste with slow coalescence rate, or slow wetting rate, will be most desirable. Processwise, allowing the paste to stay at soaking zone for longer time will dry out the volatiles, and reduce the chance of
Electronics Forum | Tue Nov 27 13:36:22 EST 2001 | jmathis
Solder balls on the topside of our wave solder boards is a real issue. We have found that during the wave solder process, solder will enter through the via holes in the form of solder balls. It seems to be related to flux captured in the vias and o
Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef
You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu
Electronics Forum | Tue Jan 08 14:54:10 EST 2002 | Yannick
Hi, I experience some trouble with my solder joint recently. And I'm wondering if someone could help me with this. First I use a thermocouple wich I must tape to the board to profile my temperature. I want to buy the Temprobe from Saunder Tech
Electronics Forum | Thu Dec 05 11:36:30 EST 2002 | William Guatemala
Have you check the flux gravity lately? If not, Check the flux gravity every 6 hours to make sure proper parameters are meet. Here is a list of things that may cause your solder ball problems; Excecive heat, defective fixtures, preheating temperature
Electronics Forum | Thu Aug 12 14:55:08 EDT 2004 | johnw
Hi guys I havnt been on for a while so its nice to be back been working in europe mostly Fuji CP6 skewing rnets Marcels comment is the closest rnets are a problem as said before the main areas are 1 A good assmbley shape is a must with 30% defaul
Electronics Forum | Mon Aug 16 16:57:06 EDT 2004 | Shean Dalton
Try to observe the board as it exits the wave, look for solder snapping as the leads finally exit the solder. The surface tension could be such that a "string" of solder stretches away from the wave until it finally breaks. Then, as the string reco
Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007
We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f
Electronics Forum | Mon Nov 13 10:02:52 EST 2006 | pforister
Bill, We only allow 3 boards to be printed in front of the pick and place equipment. It is important to keep the abandon time to a minimum. You did not mention the paste that you use. Do you use no-clean or water soluble? Do you use lead free?
Electronics Forum | Thu Jan 31 10:20:04 EST 2013 | rjohnston58
Need your help with a referee call on solder balls. See attached pictures. Engineering believes the solder balls and splash in pictures violate IPC-A-610E-2010 section 5.2.7.1. Purchasing on the other hand believes these are acceptable. Info: balls a
