Electronics Forum | Wed Feb 06 07:44:57 EST 2013 | mlevesque
Hi, Sorry, your website doesn't work :(. When you talk about SRT machine, you talk about the SRT1100 from Summit?? Someone have worked with the new SRT Micra?? Thank you
Electronics Forum | Tue Nov 01 01:36:27 EST 2005 | mki
Hi, I am looking for opinion about possibility to do BGA rework with SRT-FPD? This early model (before 2000) is equiped with "Variable Perimeter Heater" (VPH). For BGA rework, SRT introduced later "Summit" models with removable nozzles. I am wonderin
Electronics Forum | Wed Sep 29 12:51:55 EDT 1999 | Bob Barr
Never heard of the DRS-22C. I have had a DRS-22 for several years now. Purchased it when we started doing BGA's. The operators like it - good optics (split view), built like a tank, X-Y table easy to manipulate for alignment. I like it because I ca
Electronics Forum | Tue Sep 28 08:27:55 EDT 1999 | Earl Moon
| if anyone has used or has one of these bga rework stations please give me your opinion on them. I am planning on using the sytem for not only rework but also low volume prototype production for hand built 1 or 2 qty pcb's, so ease of use is impor
Electronics Forum | Thu Jul 31 09:03:36 EDT 2003 | russ
Are you baking the parts prior to installation? I have found that this will help in some cases. Russ
Electronics Forum | Thu Jul 31 12:08:12 EDT 2003 | Kris
Hi, Are you printing the paste uniformly ?
Electronics Forum | Thu Jul 31 21:22:57 EDT 2003 | praveen
Yes the paste printing is uniform. I have not tried out paste flux yet.
Electronics Forum | Wed Jul 30 00:05:05 EDT 2003 | praveen
Hi, I am observing warpage in the PBGA during reflow in rework machine.Reflow profile is std. (Peak temp is 214 deg C using 63/37 paste). Please advise what should be the gap between the nozzle and the BGA body during reflow process in SRT BGA rework
Electronics Forum | Thu Jul 31 15:29:25 EDT 2003 | bcceng
A couple of things you can look into 1. The proper bottom pre-heat of board. If you are applying only direct hot air to BGA without preheating can cause BGA's to warp and collapse un-even. 2. Moisture on you BGA's. If BGA's were not properly packa
Electronics Forum | Thu Jul 31 21:21:54 EDT 2003 | praveen
Yes we are baking the boards and the BGA. Using a CDM material pallet to hold the PCB as clamping is a problem without that.
