Electronics Forum | Tue Aug 13 02:33:04 EDT 2019 | ameenullakhan
Hi , Thanks for the reply. Yes CCGA was checked before placement and sending to reflow oven. The latest suspect form few cross functional team member is like. It is due to improper reflow profile " Column kick out " has happen. I am
Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan
Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw
From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Wed Oct 11 05:58:13 EDT 2023 | kojotssss
Hello all, I know there are very skilled guys. Can anyone suggest a stencil design to avoid component displacement during reflow to improve tension of surface forces and selfalignment? There are cases where the inductors are shifted. All parameters
Electronics Forum | Wed Oct 11 13:26:59 EDT 2023 | cyber_wolf
Its highly doubtful that stencil design will fix this. The Inductor floats during reflow and ends up going where it wants to go. The only way you are going to keep it in place is to put a dot of chipbonder beneath it or change the size of the lands
Electronics Forum | Wed Oct 11 18:30:21 EDT 2023 | kojotssss
Thanks for the opinions! You're right, it can't be solved with a stencil. I have made investigation, the problems are related to the quality of the component land surface, one of the terminal is oxidized.
Electronics Forum | Wed Oct 11 18:12:55 EDT 2023 | alexv
I don't think it's a stencil issue. You have an identical inductor next to t=it, that's perfectly straight. You have a problem in that location. I've seen some inductors be affected by slight magnetic forces in the reflow oven. Try to rotate the boar
